4 General

25.2233GPPRelease 17Spreading and modulation (TDD)TS

In the following, a separation between the data modulation and the spreading modulation has been made. The data modulation for 3.84Mcps TDD (including 3.84 Mcps MBSFN IMB) and 7.68Mcps TDD is defined in clause 5 ‘Data modulation for the 3.84 Mcps and 7.68Mcps options’, the data modulation for 1.28Mcps TDD is defined in clause 5A ‘Data modulation for the 1.28 Mcps option’ and the spreading modulation in clause 6 ‘Spreading modulation’.

Table 1 shows the basic modulation parameters for the 7.68Mcps, 3.84Mcps (including 3.84 Mcps MBSFN IMB) and 1.28Mcps TDD options.

Table 1: Basic modulation parameters

Chip rate	7.68 Mchip/s	same as FDD basic chiprate: 3.84 Mchip/s and 3.84 Mcps MBSFN IMB	Low chiprate: 1.28 Mchip/s
Data modulation	QPSK,16QAM (HS-PDSCH, MBSFN S-CCPCH and E-PUCH only)	QPSK,16QAM (HS-PDSCH, MBSFN S-CCPCH and E-PUCH only)	QPSK, 8PSK,16QAM (HS-PDSCH, E-PUCH, MBSFN S-CCPCH only), 64QAM (HS-PDSCH only)
Spreading characteristics	Orthogonal Q chips/symbol, where Q = 2p, 0 <= p <= 5	Orthogonal Q chips/symbol, where Q = 2p, 0 <= p <= 4 (For 3.84 Mcps MBSFN IMB Q = 2p, where p = 4 or 8 only)	Orthogonal Q chips/symbol, where Q = 2p, 0 <= p <= 4